3D NAND Process Variation
Problem: unexpected electrical or yield signature.
Analysis: cross section, localization, TEM/STEM, EDS and dimensional comparison.
Result: compare physical construction with expected process conditions.
Global Insight. Real-World Impact.
Advanced analysis for the systems people rely on every day.
ISS Analytical Research Centers help engineers understand the materials, devices and physical evidence behind safer transportation, reliable aviation, cleaner energy, advanced computing and the technologies shaping modern life.
How ISS Impacts the World
Better physical evidence supports better engineering decisions.
The work may begin with a cross section, a failure site, a material interface or an atomic-scale image. The value shows up in the products and systems people trust every day.
ISS provides analytical evidence and engineering support. Product safety, certification and final design decisions remain the responsibility of the product manufacturer and system owner.
Safer Mobility
Helping engineers investigate the electronics behind vehicle safety.
From airbag and sensing electronics to power devices and control systems, physical analysis can help identify defects, material changes and failure evidence.
Automotive & Power →Reliable Aviation
Supporting the hardware that keeps aircraft connected and controlled.
Microscopy, failure analysis and physical assurance can support avionics, communications, control electronics and other mission-critical hardware.
Aerospace & Defense →Cleaner Energy
Understanding the materials and electronics behind efficient energy systems.
ISS analysis can support solar, power-conversion and energy technologies by revealing interfaces, degradation, materials behavior and device-level failure evidence.
Battery & Energy →Explore ISS
Start with the question. Go deeper when you need to.
The homepage tells the impact story. The rest of the site provides the technical depth.
What We Do
Capabilities
Advanced microscopy, failure analysis, metrology, circuit edit, sample preparation and physical assurance.
How We InvestigateTechnologies
TEM/STEM, SEM, FIB-SEM, EDS, EELS, diffraction, tomography and analytical measurement.
Where It MattersIndustries
Semiconductor, AI, automotive, aerospace, energy, materials and emerging research markets.
Where We WorkResearch Centers
A growing network of specialized ISS Analytical Research Centers with complementary expertise.
A Growing Analytical Network
ISS Analytical Research Centers.
ISS is building a distributed network of specialized Analytical Research Centers, each designed around complementary analytical capabilities and a common ISS operating model.
ARC01 · ACTIVE
Vancouver, WA
FIB-SEM · Metrology · Failure Analysis · TEM-STEM
ARC02 · PLANNEDQueen Creek, AZ
Circuit Edit · Advanced Characterization · TEM-STEM · Security
FUTURE ARCMinnesota
Second Materials Research Center supporting ARC01.
FUTURE ARCTexas
Geological & Earth Materials research specialization.
FUTURE ARCNorth Carolina
Biological & Life Sciences research specialization.
Start with the question.
Your sample. Your question. Our job is to find the answer.
Capabilities
What ISS provides.
Six integrated service lines support semiconductor engineering from physical access and high-resolution imaging through measurement, failure analysis, circuit modification and authorized hardware assurance.
Not sure where to start?
Tell us the engineering question. We will build the workflow.
Technologies
The right technique for the right question.
ISS combines imaging, preparation, spectroscopy, diffraction, metrology and analytical workflows to reveal structure, composition, dimensions and failure evidence across multiple scales.
What do you need to know?
Start with the information you need.
Technique Comparison
How the technologies complement one another.
| Technique | Best For | Structural Info | Chemical Info | Dimensional Data |
|---|
One question may require more than one tool.
Start with the question. We will select the technology.
Industries
Analytical insight across advanced industries.
From semiconductor devices and AI infrastructure to energy systems, advanced materials and emerging research markets, ISS combines microscopy, characterization, metrology and engineering analysis to answer complex physical questions.
Markets We Serve
Start with your industry. We will build the analytical path.
Connected Network
Industry expertise mapped to specialized ARC capabilities.
ISS is building each Analytical Research Center around a distinct technical role. Semiconductor and materials work is anchored by Vancouver; Queen Creek expands modification, characterization and security; future centers extend the network into materials research, geological research and biological sciences.
Start with the market and the question.
ISS will route the work to the right capability and research center.
Applications
Advanced analysis for the technologies shaping tomorrow.
From 3D NAND and advanced packaging to AI processors and power devices, ISS builds the analytical workflow around the device and the engineering question.
Decapsulation & Die Exposure
Open with control. Preserve what matters.
01 - PACKAGED DEVICE
Document package condition, orientation and analytical objective.
02 - DECAPSULATION
Remove package material incrementally while protecting critical structures.
03 - ANALYSIS READY
Transfer the exposed device into SEM, FIB, TEM, circuit edit or downstream analysis.
Engineering Decisions
From observation to measurable impact.
Advanced Package Voiding
Problem: intermittent or reliability-related behavior.
Analysis: mechanical preparation, SEM, site-specific FIB and metrology.
Result: quantify voiding and characterize surrounding interfaces.
Logic Process Variation
Problem: suspect device differs from control material.
Analysis: site-specific preparation, TEM/STEM and film measurement.
Result: direct structural comparison between process conditions.
Start with the device.
Show us the challenge. We will build the analysis path.
ISS Analytical Research Centers
A national network for advanced analytical research.
ISS Analytical Research Centers bring specialized microscopy, analysis, modification and physical-device assurance closer to the engineering teams that need them. Each ARC shares a common ISS operating model while developing a distinct technical specialization.
The ARC Network
Specialized centers. One integrated ISS network.
Vancouver skyline photo: RodSager64 / CC BY-SA 4.0
ARC01 · Active
Vancouver, Washington
Vancouver is the structural-analysis and failure-investigation hub of the ARC network, combining site-specific access, quantitative measurement and high-resolution microscopy.
FIB-SEMMetrologyFailure AnalysisTEM-STEM
Queen Creek / San Tan Mountains photo: CWanamaker / CC BY 3.0
ARC02 · Planned
Queen Creek, Arizona
Queen Creek is planned as the modification, advanced-characterization and physical-security hub of the ARC network, complementing Vancouver with specialized engineering capabilities.
Circuit EditAdvanced CharacterizationTEM-STEMSilicon Security
Future Expansion
Specialized future centers built around distinct research missions.
The following markets are future ARC expansion targets and are not currently presented as operating facilities.
Future ARC
Minnesota
Materials Research Center
A second materials-focused center intended to expand research capacity, provide network redundancy and support ARC01 Vancouver.
Future ARC
Texas
Geological & Earth Materials
Planned around geological materials, mineral and earth-material research, and advanced physical characterization.
Future ARC
North Carolina
Biological & Life Sciences
Planned as the network's biological and life-sciences research specialization as ISS expands beyond its semiconductor core.
One network. Multiple specialties.
Send the question to ISS. We will route the work to the right analytical center.
ARC01 · Vancouver, Washington
Structural analysis. Quantitative measurement. Failure evidence.
The Vancouver ARC is ISS's flagship center for FIB-SEM, semiconductor metrology, failure analysis and TEM-STEM workflows.
Active ARCVancouver Specialization
Built around structural understanding and failure investigation.
FIB-SEM
Site-specific cross-sectioning, buried-feature access, serial investigation and preparation for downstream analysis.
Metrology
Critical dimensions, layer thickness, pitch, geometry and recurring process-monitoring measurements.
Failure Analysis
Evidence-driven investigation connecting symptoms with structural, material and process observations.
TEM-STEM
High-resolution internal structure, interfaces, defects and analytical characterization at nanometer-to-atomic scales.
Integrated Vancouver Workflow
Localize → Prepare → Measure → Characterize → Compare → Understand
Vancouver is designed for investigations where physical localization, controlled preparation, quantitative measurement and high-resolution microscopy must work as one coordinated path.
ARC01 · Vancouver
Start your project with the Vancouver analytical team.
ARC02 · Queen Creek, Arizona
Modify. Characterize. Challenge. Verify.
The planned Queen Creek ARC is being positioned around circuit edit, advanced characterization, TEM-STEM and silicon security / physical assurance.
Planned ARCQueen Creek Specialization
Built around physical modification, advanced characterization and security.
Circuit Edit
Precision cut, isolate, deposition, access and engineering-debug workflows using dedicated circuit-edit technology.
Advanced Characterization
Complementary analytical techniques including elemental, chemical and crystallographic characterization as projects require.
TEM-STEM
Nanoscale and atomic-scale imaging for device structures, interfaces, materials and security-sensitive investigations.
Silicon Security
Authorized invasive hardware assessment, physical-device assurance, secure teardown and FIB-based security validation.
Integrated Queen Creek Workflow
Define → Access → Modify / Challenge → Characterize → Verify → Report
Queen Creek is planned as a complementary ARC for projects that require active physical modification, deeper analytical characterization and authorized security evaluation.
ARC02 · Queen Creek
Discuss projects intended for the planned Arizona center.
About ISS
Advanced tools. Experienced people. Defensible answers.
Innovative Semiconductor Solutions is building a specialized network of Analytical Research Centers focused on helping engineers and researchers understand increasingly complex devices, materials, structures and failures across semiconductor and advanced research markets.
Built around the engineering question
The instrument is only part of the answer.
Complex semiconductor problems rarely fit neatly into a single analytical technique. ISS brings complementary preparation, imaging, spectroscopy, metrology and engineering capabilities together so customers can move through an investigation without unnecessary handoffs.
Prepare → Image → Measure → Analyze → Understand
Our Approach
Start with the question.
Understand the Objective
What happened, what changed, what must be measured and what decision must the data support?
Preserve the Evidence
Handle, prepare and document the sample in a way that protects the information it contains.
Select the Right Workflow
Choose the appropriate combination of preparation, microscopy, spectroscopy, metrology and analysis.
Communicate Clearly
Provide organized data, observations and findings engineers can use.
Scale When Required
Support both unique investigations and repeatable production-oriented analytical programs.
Protect Customer Information
Use disciplined handling and confidentiality practices for customer devices and intellectual property.
A partner, not just a lab.
See deeper. Understand more.
Resources
Technical information for better analytical decisions.
Explore capability documents, technical guides, application notes and sample-submission resources.
ISS Capability Statement
Overview of advanced microscopy, failure analysis, sample preparation and analytical capabilities.
Request / Download →Silicon Security Capability Statement
Overview of physical-security evaluation and semiconductor assurance services.
Request / Download →Sample Submission Guide
How to identify, document and prepare samples for ISS technical review.
View Guide →TEM vs. STEM
Understand what each technique reveals and when each is appropriate.
Explore →Understanding Site-Specific FIB Preparation
How targeted preparation connects a customer-defined feature to advanced microscopy.
Explore →Critical Dimension Measurement
How microscopy can support semiconductor CD and cross-sectional metrology.
Explore →Need help selecting a technique?
You do not need to know the instrument before contacting ISS.
Submit a Project
Tell us what you need to understand.
You do not need to know which microscope, preparation method or analytical technique your project requires. Start with the sample and engineering question.