3D NAND Process Variation
Problem: unexpected electrical or yield signature.
Analysis: cross section, localization, TEM/STEM, EDS and dimensional comparison.
Result: compare physical construction with expected process conditions.
Global Insight. Real-World Impact.
ISS Analytical Research Centers help engineers understand the materials, devices and physical evidence behind safer transportation, reliable aviation, cleaner energy, advanced computing and the technologies shaping modern life.
How ISS Impacts the World
The work may begin with a cross section, a failure site, a material interface or an atomic-scale image. The value shows up in the products and systems people trust every day.
ISS provides analytical evidence and engineering support. Product safety, certification and final design decisions remain the responsibility of the product manufacturer and system owner.
From airbag and sensing electronics to power devices and control systems, physical analysis can help identify defects, material changes and failure evidence.
Automotive & Power →Microscopy, failure analysis and physical assurance can support avionics, communications, control electronics and other mission-critical hardware.
Aerospace & Defense →ISS analysis can support solar, power-conversion and energy technologies by revealing interfaces, degradation, materials behavior and device-level failure evidence.
Battery & Energy →Explore ISS
The homepage tells the impact story. The rest of the site provides the technical depth.
Advanced microscopy, failure analysis, metrology, circuit edit, sample preparation and physical assurance.
How We InvestigateTEM/STEM, SEM, FIB-SEM, EDS, EELS, diffraction, tomography and analytical measurement.
Where It MattersSemiconductor, AI, automotive, aerospace, energy, materials and emerging research markets.
Where We WorkA growing network of specialized ISS Analytical Research Centers with complementary expertise.
A Growing Analytical Network
ISS is building a distributed network of specialized Analytical Research Centers, each designed around complementary analytical capabilities and a common ISS operating model.
FIB-SEM · Metrology · Failure Analysis · TEM-STEM
ARC02 · PLANNEDCircuit Edit · Advanced Characterization · TEM-STEM · Security
FUTURE ARCSecond Materials Research Center supporting ARC01.
FUTURE ARCGeological & Earth Materials research specialization.
FUTURE ARCBiological & Life Sciences research specialization.
Start with the question.
Capabilities
Six integrated service lines support semiconductor engineering from physical access and high-resolution imaging through measurement, failure analysis, circuit modification and authorized hardware assurance.
Not sure where to start?
Technologies
ISS combines imaging, preparation, spectroscopy, diffraction, metrology and analytical workflows to reveal structure, composition, dimensions and failure evidence across multiple scales.
What do you need to know?
Technique Comparison
| Technique | Best For | Structural Info | Chemical Info | Dimensional Data |
|---|
One question may require more than one tool.
Industries
From semiconductor devices and AI infrastructure to energy systems, advanced materials and emerging research markets, ISS combines microscopy, characterization, metrology and engineering analysis to answer complex physical questions.
Markets We Serve
Connected Network
ISS is building each Analytical Research Center around a distinct technical role. Semiconductor and materials work is anchored by Vancouver; Queen Creek expands modification, characterization and security; future centers extend the network into materials research, geological research and biological sciences.
Start with the market and the question.
Applications
From 3D NAND and advanced packaging to AI processors and power devices, ISS builds the analytical workflow around the device and the engineering question.
Decapsulation & Die Exposure
Document package condition, orientation and analytical objective.
Remove package material incrementally while protecting critical structures.
Transfer the exposed device into SEM, FIB, TEM, circuit edit or downstream analysis.
Engineering Decisions
Problem: unexpected electrical or yield signature.
Analysis: cross section, localization, TEM/STEM, EDS and dimensional comparison.
Result: compare physical construction with expected process conditions.
Problem: intermittent or reliability-related behavior.
Analysis: mechanical preparation, SEM, site-specific FIB and metrology.
Result: quantify voiding and characterize surrounding interfaces.
Problem: suspect device differs from control material.
Analysis: site-specific preparation, TEM/STEM and film measurement.
Result: direct structural comparison between process conditions.
Start with the device.
ISS Analytical Research Centers
ISS Analytical Research Centers bring specialized microscopy, analysis, modification and physical-device assurance closer to the engineering teams that need them. Each ARC shares a common ISS operating model while developing a distinct technical specialization.
The ARC Network

Vancouver is the structural-analysis and failure-investigation hub of the ARC network, combining site-specific access, quantitative measurement and high-resolution microscopy.
Queen Creek is planned as the modification, advanced-characterization and physical-security hub of the ARC network, complementing Vancouver with specialized engineering capabilities.
Future Expansion
These locations are future ARC expansion markets and are not yet operating ISS facilities. Representative city imagery is shown until final site selection is announced.

Future ARC
Materials Research Center
A second materials-focused center intended to expand research capacity, provide network redundancy and support ARC01 Vancouver.
Explore Minnesota ARC
Future ARC
Geological & Earth Materials
Planned around geological materials, mineral and earth-material research, and advanced physical characterization.
Explore Texas ARC
Future ARC
Biological & Life Sciences
Planned as the network's biological and life-sciences research specialization as ISS expands beyond its semiconductor core.
Explore North Carolina ARCOne network. Multiple specialties.
ARC01 · Vancouver, Washington
The Vancouver ARC is ISS's flagship center for FIB-SEM, semiconductor metrology, failure analysis and TEM-STEM workflows.
Active ARC
Vancouver Specialization
Site-specific cross-sectioning, buried-feature access, serial investigation and preparation for downstream analysis.
Critical dimensions, layer thickness, pitch, geometry and recurring process-monitoring measurements.
Evidence-driven investigation connecting symptoms with structural, material and process observations.
High-resolution internal structure, interfaces, defects and analytical characterization at nanometer-to-atomic scales.
Integrated Vancouver Workflow
Vancouver is designed for investigations where physical localization, controlled preparation, quantitative measurement and high-resolution microscopy must work as one coordinated path.
ARC01 · Vancouver
ARC02 · Queen Creek, Arizona
The planned Queen Creek ARC is being positioned around circuit edit, advanced characterization, TEM-STEM and silicon security / physical assurance.
Planned ARCQueen Creek Specialization
Precision cut, isolate, deposition, access and engineering-debug workflows using dedicated circuit-edit technology.
Complementary analytical techniques including elemental, chemical and crystallographic characterization as projects require.
Nanoscale and atomic-scale imaging for device structures, interfaces, materials and security-sensitive investigations.
Authorized invasive hardware assessment, physical-device assurance, secure teardown and FIB-based security validation.
Integrated Queen Creek Workflow
Queen Creek is planned as a complementary ARC for projects that require active physical modification, deeper analytical characterization and authorized security evaluation.
ARC02 · Queen Creek
Future ARC · Minnesota
Minnesota is planned as a future ISS Materials Research Center designed to expand materials-characterization capacity, provide network redundancy and support the Vancouver flagship.
Future ARC Market
Planned Specialization
Thin films, coatings, metals, oxides, ceramics, particles and engineered interfaces.
High-resolution structural and analytical characterization for materials research.
Microstructure, cross-sectioning, site-specific access and materials preparation.
Elemental, chemical and crystallographic characterization as the center develops.
Network Role
The Minnesota center is planned as a second materials-focused node that can absorb research demand, broaden materials capability and provide operating redundancy across the ISS ARC network.
Future Minnesota ARC
Future ARC · Texas
Texas is planned as the geological and earth-materials specialization within the future ISS ARC network.
Future ARC Market
Planned Specialization
Characterize grains, pores, interfaces, inclusions and morphology.
EDS and related workflows for composition and spatial distribution.
Support crystallographic and phase questions in complex geological materials.
Tomographic and serial workflows for structures that cannot be understood from a single section.
Network Role
The Texas ARC is planned to adapt the preparation, imaging, measurement and characterization discipline developed in semiconductor analysis to geological research.
Future Texas ARC
Future ARC · North Carolina
North Carolina is planned as the biological and life-sciences research specialization within the future ISS ARC network.
Future ARC Market
Planned Specialization
Advanced imaging for structures and interfaces that require nanoscale investigation.
Preparation workflows adapted to preserve the structures required for meaningful analysis.
Combine multiple imaging and analytical techniques when one method does not answer the full question.
Support repeatable research workflows where consistency, documentation and comparative analysis matter.
Network Role
The North Carolina ARC is planned to bring ISS's evidence-first analytical model into biological and life-sciences research while developing domain-specific preparation and characterization expertise.
Future North Carolina ARC
About ISS
Innovative Semiconductor Solutions combines semiconductor failure analysis, advanced microscopy, precision sample preparation, metrology, circuit edit and physical-device assurance inside a growing network of specialized Analytical Research Centers.
Our Direction
ISS began with a semiconductor-analysis foundation: prepare the device correctly, image the right feature, measure what matters and preserve enough context to support a defensible engineering decision.
The Analytical Research Center model expands that discipline into specialized centers. Each ARC can develop deep technical expertise while operating within one ISS framework for project intake, sample control, analytical workflow, communication and secure data handling.
Our role is not simply to provide instrument time. We start with what the customer needs to understand and build the analytical path around that objective.
What Defines ISS
The starting point is the decision the customer must make—not a predefined instrument menu.
Preparation, imaging, metrology, characterization and interpretation are connected into one analytical path.
Research centers develop distinct specialties while remaining part of one operating and technical network.
Sensitive devices, data and intellectual property are handled with controlled access and customer-approved workflows.
Explore ISS
Current technical openings and what it means to build expertise inside an Analytical Research Center.
InfrastructureHow microscopy, preparation, characterization and facility systems work together.
ExecutionDocumented methods, traceability, review and repeatable technical execution.
SecurityControlled sample movement, confidential project handling and approved data exchange.
PartnershipWhy customers choose one integrated analytical organization instead of disconnected services.
NetworkExplore Vancouver, Queen Creek and the future ARC expansion network.
The ISS Model
Every project begins with what the customer needs to understand. The preparation method, analytical technologies and research center are selected around that objective.
A partner, not just a lab.
Resources
ISS resources are designed to help engineers and researchers understand analytical options, prepare projects, communicate targets and select the right path before samples arrive.
Resource Library
Examples of how analytical workflows address semiconductor, packaging, materials and reliability questions.
OverviewConcise overviews of ISS service lines, security capabilities and analytical infrastructure.
DocumentsApproved public documents, brochures and technical materials organized in one place.
Before You ShipHow to identify, document, package and communicate samples for technical review.
LearnPlain-language explainers covering microscopy, FIB preparation, metrology, EDS/EELS and related methods.
Technique SelectionStart with the question and compare the technologies ISS may use to answer it.
Featured Resources
Overview of advanced microscopy, failure analysis, sample preparation and analytical capabilities.
Explore Capability Statements →Authorized physical-device security evaluation and hardware assurance capabilities.
View Security Resources →What to send, how to label it and what project information helps ISS start efficiently.
View Guide →Need help selecting a technique?
Submit a Project
You do not need to know which microscope, preparation method or analytical technique your project requires. Start with the sample and engineering question.